The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.
本发明缩小了半导体器件的封装尺寸，降低了产品成本。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
应用推荐