IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
The symposium is the annual meeting sponsored by the International Microelectronics and Packaging Society with hundreds of exhibitors and technical sessions.
本届研讨会是由国际微电子与封装协会主办的，每年一届，届时将有数百家参展商参加及很多技术会议。
The symposium is the annual meeting sponsored by the International Microelectronics and Packaging Society with hundreds of exhibitors and technical sessions.
本届研讨会是由国际微电子与封装协会主办的，每年一届，届时将有数百家参展商参加及很多技术会议。
应用推荐