• It can raise the efficiency of packing, save packaging cost, improve packaging level.

    其包装成本低、效率高、提升包装档次。

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  • Here some concrete methods are mentioned of how to raise the level of the packaging design.

    对如何提高名优烟的包装装潢设计水平谈了一些具体方法。

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  • Intensifying packaging information is an important approach to upgrade the level of packaging design.

    强化包装信息是提升包装设计水平的一个重要途径。

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  • In the observation and analysis to packaging design, we can find excessive commercialization is the fundamental reason of that the level of design works can not rapidly improve.

    在对包装设计的观察与分析中,可以发现过分的商业化是设计作品没有迅速提高的根本原因。

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  • Packaging gift box can be said that the printing industry, a manifestation of the highest technological level of its production process is very complicated.

    包装礼盒可以说是印刷业最高工艺水平的体现,其生产工艺十分复杂。

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  • And we will bring forward some experience in training high level science and technology persons on packaging engineering.

    归纳了包装工程高级科技人才培养中的若干体会。

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  • Automatic bag packaging machine is to the international level that are popular as a new type of packaging machine.

    全自动给袋式包装机是国际上正在流行的一种新型包装机。

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  • United States, a new study shows in food packaging materials, paper and textiles in common use in the class of compounds called whole fluorine alkyl chemicals affect human blood cholesterol level.

    美国一项最新研究显示,在食品包装材料、纸张和纺织品中常用的一类被称作全氟烷基化合物的化学物质会影响人体血液中胆固醇水平。

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  • First introduced at the technical level the characteristics of line packaging advantages.

    首先在技术层面上介绍在线包装的特点、优势。

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  • With many years experience in product design major, our pet products have reached international advanced level and owned unique patents in appearance, structure, quality and packaging.

    凭借多年专业产品设计经验,我司的宠物产品在外观、结构、品质以及包装制作方面均达到国际领先水平,拥有诸多专利。

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  • Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

    阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

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  • Brazilian farmers have the highest level of recycling and correct disposal of agricultural packaging in the world.

    巴西农民拥有世界上最高级的农业包装再循环和正确处理的水平。

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  • The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.

    本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。

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  • Leak of the product with moisture, security, oxidation, corrosion, fresh, extended shelf-life functions, improve the product level, the integrity of packaging.

    具有对产品防漏防潮、防伪、防氧化、耐腐蚀、保鲜、延长保质期的功能、提高产品等级、实现包装的完整性。

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  • With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.

    随着芯片集成度及整机安装紧凑性的提高,计算机发热密度近年来一直呈指数级增长。

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  • In order to improve the automatic production level of beer packaging production line, an inspection system of empty beer bottle based on DSP and FPGA is designed.

    为了提高啤酒灌装线生产自动化的水平,开发设计了一套基于DSP与FPGA的啤酒瓶空瓶检测系统。

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  • This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.

    文章论述了超csptm圆片级封装技术工艺。

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  • Wire bonding is still the most popular interconnect technology in the first-level packaging.

    一级封装中最流行的互连技术仍为丝焊。

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  • Widely applicable technology, stationery, food, toys, clothing, electronics, hardware, and other high-level internal and external packaging.

    广泛适用于工艺、文具、食品、玩具、服装、电子、五金等内外高级包装。

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  • This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heat curable adhesives.

    本文讨论纳米精确度光学对准技术,以用于采用热固化树脂的微光学包装。

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  • The structure may have less complex focusing, reduced crosstalk, tighter pixel packing density, increased quantum efficiency, and wafer-level packaging.

    所述结构可具有较不复杂的聚焦、减小的串扰、较紧密的像素组装密度、提高的量子效率及晶 片级封装。

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  • Due to the complicity of the component's functions and the variety of device's packaging, the component level testing is getting more and more difficult.

    随着器件功能的日益复杂和封装的多样化,实现器件级的鉴定越来越困难。

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  • Due to the complicity of the component's functions and the variety of device's packaging, the component level testing is getting more and more difficult.

    随着器件功能的日益复杂和封装的多样化,实现器件级的鉴定越来越困难。

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