• Another benefit is that we get to learn some of the best practice in release engineering (build, source control MGMT, packaging etc) from other Eclipse projects.

    另一个益处是我们在发布工程中从其他Eclipse项目里学到了一些最佳实践(构建、源文件控制管理、打包等等)。

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  • The packaging mode is unrestricted, e. g. plastic woven sack packaging, plastic film packaging, bucket packaging or can packaging etc.

    包装形式不受限制,如编织袋包装、塑料薄膜包装、桶包装或罐包装形式。

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  • The reason for wet salt caking is analyzed from the aspects of impurity content of salt, drying, cooling, conveying and packaging etc.

    本文从盐品杂质含量、干燥、冷却、输送、包装等环节分析了盐品吸湿结块的原因。

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  • Zhangjiagang City Jiaxin Sheet co., Ltd. mainly manage new metal material including duplex metal composite, solid and liquid composite, advanced metal packaging etc.

    张家港市嘉信薄板有限公司主营双金属复合、固液复合、高级金属包装等金属新材料业务。

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  • In this paper, the production of harmony liquor in the aspects including color, aroma, taste, styles and packaging etc. was elaborated.

    从白酒色、香、味、格及外包装的协调几方面论述了“和谐”酒的酿造,其中“和谐”酒的关键点是香味幽雅谐调、风格独特典型。

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  • Ordering items pertaining to the manufacture of goods: such as raw material, packaging, etc. , while at all times controlling costs and obtaining price advantages.

    订购原材料,包装等涉及到产品的相关项目,同时控制成本,并获得价格优势。

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  • Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

    阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

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  • Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.

    阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。

    youdao

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