Put the unit tests in the same package as the associated classes being tested.
将单元测试与被测试的相关类放在同一个包内。
Ensuring that your package really represents a "fully deployable unit" is critical to achieving reliable deployments, especially in large-scale environments.
确保软件包是“完备的可部署单元”对于一次可靠的部署来说是至关重要的，特别是在大规模环境中。
Package chillers are a complete chiller system including condensing unit, tank and pump built entirely into a single cabinet.
水冷冷却系统是一套完整的制冷系统，包括冷凝机组，水箱和泵，装载在一个机箱中。
The application apparatus comprises an optical detection unit (30) for detecting an application point on one of the packages (20) on the package conveyor.
施加装置包括用于检测包装传送带上的其中一个包装(20)上的施加点的光学检测单元(30)。
The contents of transport package information and the concept of virtual logistics unit are discussed.
讨论了物流单元运输包装信息的内容和虚拟物流单元的概念。
"Shipping unit" means any physical unit of cargo not shipped in a package, including machinery, vehicles and boats, except goods shipped in bulk.
是指未以包件运输的任何一个具体单位的货物，包括机械、车辆及船只，但散装货物除外。
A winding unit 10 in an automatic winder is configured to wind a predetermined length of yarn 20 into a package 30.
自动络纱机的卷绕单元（10）构成为能够将规定长度的纱线卷 绕到卷装（30）上。
An automatic laser power control circuit comprises a laser diode package, a voltage adjusting unit and a polarity adjusting unit.
一种自动激光功率控制电路，包括：激光二极管封装件，电压调节单元和极性调节单元。
This module used DIP ceramic package, therefore it is very easy to form 16, 32,... and 160 unit modules.
组件采用双列直插式陶瓷管壳封装，很容易制成16、32……160元组件。
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
All MCUs in the family use the enhanced M68HC08 central processor unit (CPU08) and are available with a variety of modules, memory sizes and types, and package types.
该系列的全部MCU均采用增强型m 68hc08中央处理器(CPU08)，并提供各种模块、不同大小的内存和类型、以及封装选择。
All MCUs in the family use the enhanced M68HC08 central processor unit (CPU08) and are available with a variety of modules, memory sizes and types, and package types.
该系列的全部MCU均采用增强型m 68hc08中央处理器(CPU08)，并提供各种模块、不同大小的内存和类型、以及封装选择。
应用推荐