Nvidia has said the defect-which affected laptop PCs from H-P, Dell Inc., Apple Inc., and other vendors-was caused by materials used to package the chips.
英伟达声称，故障是由于显卡包装材料导致的。受此故障影响的笔记 本电脑涉及惠普、戴尔(DellInc.)、苹果(AppleInc.)等多家厂商。
Patented H. E. P. A. filtered vacuum for the recovery of lead, dust, paint chips, and other hazardous materials.
拥有专利技术，用于回收铅、尘土、油漆片和其他危险材料。
It emphasizes preconditioning (p), refiner chemical treatment (RC), and proper distribution of bleaching reactions between the two after the chips being chemically impregnated.
主要包括木片的预处理(P)、盘磨化学处理(RC)及木片经预浸后漂白反应在两者之间的合理分配等。
LED is the core of the P-type semiconductor and components of the N-type semiconductor chips.
发光二极管的核心部分是由P型半导体和N型半导体组成的晶片。
Tips are positioned in opposite shear Angle, very good chips evacuation. Max r. p. m 20000.
刀头按反向剪切角布局，具有优秀的排屑效果，最大转速为20000转每分钟。
Tips are positioned in opposite shear Angle, very good chips evacuation. Max r. p. m 20000.
刀头按反向剪切角布局，具有优秀的排屑效果，最大转速为20000转每分钟。
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