A unique oxide thinning process is proposed in order to investigate the effect of oxide thickness on soldering properties.
为研究不同氧化层厚度对焊料性能的影响，开发出一种新的焊料表面氧化层减薄工艺。
However, when oxide thickness increased to a fixed value at a specific oxide field, the increase in gate leakage current caused by a single oxygen vacancy could be neglected.
但当厚度在特定值及特定电场下时，单个氧空位引起的栅漏电流增加可以忽略。
Chemical removal approach is utilized and the oxide thickness is controlled by controlling the oxygen pressure and temperature during solder drying after organic acid removal.
采用化学腐蚀法，通过控制有机酸腐蚀后焊料烘干的氧分压和温度控制焊料表面氧化层厚度。
Chemical removal approach is utilized and the oxide thickness is controlled by controlling the oxygen pressure and temperature during solder drying after organic acid removal.
采用化学腐蚀法，通过控制有机酸腐蚀后焊料烘干的氧分压和温度控制焊料表面氧化层厚度。
应用推荐