The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
To preview the packages before you bind them, go to the SQL tab of the pureQuery outline view and click on the potential package.
要在绑定包之前进行预览，转到pureQuery大纲视图的SQL标签并单击可能的包。
Note also the use of new capabilities in 2.2, including the ability to bind a single package from a captured PDQXML from the SQL outline database TAB.
还要注意版本2.2中的新功能，包括从SQL大纲数据库选项卡绑定一个捕获的pd qxml中的单个包的能力。
The outline of a rescue package for Ireland is emerging from the vortex of the latest euro-zone crisis.
从最近欧元区危机的旋涡中，慢慢浮现出了爱尔兰一揽子救助计划的框架。
It sits at the top of your editor window, just below the tabs, and provides the functionality of both the Package Explorer and Outline views (see Figure 9).
它位于编辑器窗口的顶部，刚好位于选项卡下方，并且提供了PackageExplorer和Outline视图的功能(参见图9)。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
Describes the importance of development of process design package and how to prepare the outline of process design package for discussion.
叙述工艺包开发的重要性，提出了工艺包的编写提纲，供大家讨论。
This paper presents some types of high density package, describes their general constructions and also shows the outline standards of these packages.
本文叙述了高密度封装的类型，介绍了它们的一般结构，并提供了封装的外形标准。
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
该器件提供两种封装：24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
应用推荐