• This paper analyzes the failure mechanism of semiconductor P N junction temperature sensors and presents a new design to reduce the internal stresses and methods to improve the processes.

    通过失效形式,分析了半导体P-N结温度传感器的失效机理,介绍了为降低内应力而进行的设计和工艺改进。

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  • Phosphine (PH3) is an important electronic specific gas which is mainly used in fields of N-type semiconductor doping, ion implement and chemical vapor deposition (CVD) etc.

    磷化氢(PH3)是一种重要的电子特气,主要用于n型半导体的掺杂、离子注入和化学气相沉积(CVD)等。

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  • A semiconductor device structure (10) uses two semiconductor layers (16 & 20) to separately optimize N and P channel transistor carrier mobility.

    一种半导体器件结构(10),其使用两个半导体层(16&20)以分别优化N和P沟道晶体管载流子迁移率。

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  • The smallest unit that supports electron flow in a semiconductor material ; a hole in P-type silicon or a free electron in N-type silicon.

    多数载流子-一种载流子,在半导体材料中起支配作用的空穴或电子,例如在N型中是电子。

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  • The source region and the drain region comprise a semiconductor junction mixedly formed by a Schottky junction and a P-N junction.

    所述源极区域及漏极区域包括由肖特基结和P-N结混合形成的半导体结。

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  • The source region and the drain region comprise a semiconductor junction mixedly formed by a Schottky junction and a P-N junction.

    所述源极区域及漏极区域包括由肖特基结和P-N结混合形成的半导体结。

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