The present invention provides a multichip package, including a plurality of storage chips and control chips.

本发明提供一种多芯片封装。该多芯片封装包括多个存储芯片和控制芯片。

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The present invention provides a multichip package, including a plurality of storage chips and control chips.

本发明提供一种多芯片封装。该多芯片封装包括多个存储芯片和控制芯片。

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