IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
Microelectronics packaging machine control technology used in Japan to achieve a safe and unmanned operation, high productivity, greatly enhance the international competitiveness on the market.
日本用微电子技术控制包装机，达到安全性高、无人操作、高生产率，大大提高了国际市场竞争能力。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
微电子连接技术是微电子封装技术中的重要环节。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
微电子连接技术是微电子封装技术中的重要环节。
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