Using IC-compatible silicon as substrate and MEMS processing technology, it is fabricated with silicon wet etching and SU8 micro reaction pool.
以与IC兼容的硅作为基底材料，利用MEMS加工工艺，采用硅腐蚀及SU8微反应池方法制成了新型微电极传感器。
Using IC-compatible silicon as substrate and MEMS processing technology, it is fabricated with silicon wet etching and SU8 micro reaction pool.
以与IC兼容的硅作为基底材料，利用MEMS加工工艺，采用硅腐蚀及SU8微反应池方法制成了新型微电极传感器。
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