This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heat curable adhesives.
本文讨论纳米精确度光学对准技术，以用于采用热固化树脂的微光学包装。
The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
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