Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.

因此，对微电子封装器件的温度分布以及热应力进行研究就显得十分重要，具有重要的理论和实际意义。

youdao

Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.

因此，对微电子封装器件的温度分布以及热应力进行研究就显得十分重要，具有重要的理论和实际意义。

youdao