This paper introduces the classes, particularities and basic demands of RF MEMS packaging.
本文介绍了RFMEMS封装的分类、特殊性和基本要求。
Based on serial port communication, a sort of long-distance control applications of MEMS packaging by laser was introduced.
介绍一种基于串口通信，激光封装MEMS芯片的远程控制应用方案。
The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
At last, the trends of MEMS and MEMSpackaging are prospected, and the integrated MEMS system packaging is discussed.
最后对MEMS和MEMS封装的走向进行了展望，并对全集成MEMS系统的封装进行了一些探讨。
Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
The vacuum obtains and maintenance is still still the main problem in the field of MEMS vacuum packaging technology.
真空的获得和维持是目前MEMS真空封装技术中存在的主要难题之一。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Potting is a key step for the packaging of high-g micro-electro-mechanical system(MEMS) accelerometer.
灌封是高量程微机械加速度计实用化的一个关键步骤。
The vacuum packaging result of MEMS devices show good effect of this equipment.
MEMS器件真空封装试验表明，该装备封装效果良好。
At last, two kinds of models are Elaborated on MEMS device and its packaging.
阐述了MEMS器件及其封装中主要的两种模型。
This is the main factor to the failure in packaging. Therefore, We put forward the concept of MEMS process mechanics. Much more researches are done about this concept in this paper.
为此，本文提出了MEMS器件及封装中的工艺力学概念，并围绕这个概念所涉及的主要问题进行了研究。
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
The packaging process of vacuum reflowing soldering using in MEMS micro-gyro packaging was built and realized.
实现了MEMS微陀螺仪的真空封装工艺并优化了工艺参数；
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