Firms like MCM fit into the consultant category.
MCM公司则属于专业顾问。
The dissertation discussed the whole procedure of developing MCM layout editor.
本文论述了MCM布线编辑器的整个开发过程。
To participate in MCM a team must be sponsored by a faculty advisor from their institution.
每个参赛团队需有一名所在学校的指导老师负责。
A Monte Carlo Method (MCM) is introduced to determine the radiation spectrum for particle material.
本文采用蒙特卡洛方法(MCM)对颗粒材料的辐射光谱进行模拟计算。
OBJECTIVE: To improve drug burst release and stagnant release of magnetic cisplatin microspheres (MCM).
目的：改善磁性顺铂微球的药物突释和滞释，实现控释。
This article discusses the synthesis, modification, characterization and catalysis performance of MCM-41.
本文对MCM - 41介孔分子筛的合成、改性、表征与催化性能进行了扼要的评述。
Y-MCM-41 containing secondary building units of Y zeolite was prepared and then treated by ion exchange method.
制备了含有Y沸石次级结构单元的Y-MCM-41，并对其进行离子交换处理。
The main kinetic mode of MCM is analyzed. The technical requirements of the polishing manipulator are presented.
分析了多模式加工的主要运动方式，提出了对抛光机械手的具体要求。
Supported by institute 38 of CECT, a S-band miniaturize T/R module based on MCM technology is studied in this paper.
本课题结合中电科技集团38所的科研项目，研制了一种基于MCM技术的小型化S波段T/R组件，达到了良好的效果。
MCM is the necessary technique to realize the equipment smaller, lighter, more excellent performance and lower cost.
多芯片组件是实现电子装备小型化、轻量化、高性能、低成本专用集成电路不可缺少的关键技术。
Trypsin was immobilized on the Mesoporous Molecular Sieve MCM-41 with the aid of the coupling agent, glutaraldehyde.
以介孔分子筛m CM - 41作为载体，戊二醛作为交联剂，对胰蛋白酶进行了固定化。
The planar diode is calculated by means of MCM and compared with the analytical solution. The relative error is 0.8%.
用蒙特卡洛法计算了平面二极管并与解析解进行比较，相对误差为0.8％；
For the Four Via routing algorithm used in MCM routing, the maximum weighted non crossing match problem should be solved.
四通孔布线算法用于实际MCM布线时，需要解决最大加权不相交匹配问题。
MCM-22 zeolite was synthesized under stirring by hydrothermal method and used as the catalyst for butene oligomerization.
采用水热法合成了新型多孔材料MCM - 22分子筛，并将其用于丁烯齐聚反应。
Tests results showed that this method could test MCM effectively at a shorter time with a fault coverage of more than 95%.
建立模型进行验证的结果表明：该方法能有效地测试MCM，缩短了测试时间，故障覆盖率达到95%以上。
The structure, failure model and mechanism of MCM are analyzed and the failure rate prediction model for MCM is presented.
通过对多芯片组件(MCM)的结构、失效模式和机理的分析，提出了适合我国生产实际的mcm失效率预计模型。
Cdc7 phosphorylates MCM proteins bound to chromatin and, in conjunction with CDT1, recruits the replication factor cdc45 (3-5).
Cdc7与CDT1配合磷酸化结合在染色质上的MCM蛋白，募集复制因子cdc45 (3 - 5)。
The Mathematical Association of America (MAA) will designate one Outstanding Team from each problem for the MCM as a MAA winner.
美国数学协会（MAA）将从MCM的每个题目中指定一个杰出队作为一个MAA赢家。
The characteristic results showed that the MCM-48 material possessed high specific surface areas and well-ordered channel systems.
结果表明，合成的MCM-48材料具有高的比表面积和高度有序的孔道系统。
MCM-48 synthesized at high pressure appeared higher thermal and hydrothermal stability than that synthesized at autogenous pressure.
与常压合成的相比，高压下合成的MCM - 48具有更高的热稳定性和水热稳定性。
The Society for Industrial and Applied Mathematics (SIAM) will designate one Outstanding team from each MCM problem as a SIAM winner.
工业与数学应用协会（SIAM）将会从每一个MCM问题中选出一个优秀的队伍作为SIAM奖的获得者。
A thermal model of the MCM-D package has been obtained, taking into account all the thermal resistances added by this kind of package.
已获得MCM封装的热模型，并考虑由此类封装增加的所有的热电阻。
Objective: Improving drug burst release and stagnant release of magnetic cisplatin microspheres (MCM) and achieving controlled release.
目的：改善磁性顺铂微球的药突释和滞释，实现控释。
The IRDV tool as part of the Quartet-HT system uses 100% ceramic MCM electronics to ensure reliable operation at ultrahigh temperatures.
IRDV工具采用100％陶瓷MCM电子元件以保证在超高温度条件下可靠运行。
This paper Outlines the design of features related to test and then details the Boundary Scan test strategies developed for different MCM.
本文概要论及与测试相关的设计特性，详细讨论了不同MCM的边界扫描测试策略。
This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.
本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。
This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.
本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。
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