However, when exerted at such high levels onto a thin wafer substrate, the material is not only separated, but may also be damaged severely.
然而，用如此高的能量来切割时，不仅会被分开还会严重的损坏。
However, when exerted at such high levels onto a thin wafer substrate, the material is not only separated, but may also be damaged severely.
然而，用如此高的能量来切割时，不仅会被分开还会严重的损坏。
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