In the process of EDM, dielectric medium has remarkable influence on material removal rate, surface quality of the workpiece and relative electrode wear ratio.
电火花加工中，放电介质对工件的材料去除率、表面质量以及电极相对损耗率有重要影响。
An experiment on material removal amount with the cutting distance and shape of passage is described.
介绍了用于研究材料去除量与加工距离和形状关系的实验。
It is a contradiction to achieve a high material removal rate and a super smooth surface in lapping of magnetic head.
同时获得高去除率和超光滑平整的表面是硬盘磁头自由磨粒抛光的矛盾，研究自由磨粒抛光材料去除规律可以优化抛光工艺。
These measurements have correlated well with those made in conventional constant material removal rate grinding tests.
这些测量结果与用传统的恒磨除率磨削试验具有良好的相关性。
The results are important for the understanding of the mechanism of material removal in the CMP of microelectronic materials.
其结果对于正确理解微电子材料cmp加工中的材料去除机理具有实际意义。
Using the polishing pad with grooves or rougher surfaces can increase the material removal and planarization rate.
抛光垫粗糙的表面有利于提高材料去除率。
Metal cutting process is a very complex process. Fig. 7.2 shows the basic material removal operation schematically.
金属切削过程是一个很复杂的过程。图7.2用图的形式显示了基本材料去除作业。
Material removal profile is proposed to describe the depth of material removal orthogonal to the tool path on a mold surface.
提出用表面去除廓形来描述模具表面在垂直于抛光轨迹方向的抛光去除量。
The experimental results show that the tool materials and cooling condition have obvious influences on material removal rates.
结果表明：刀具材料和冷却方式是影响玻璃陶瓷材料加工去除的主要因素。
The small value of glass breakage diameter and high material removal rates can be obtained by using diamond tool with small slots.
在电镀金刚石工具端部开槽，可获得小的玻璃崩边直径和高的材料去除率。
The dissertation constructs a relatively completed library of material removal volumes and describes the elements of it in detail.
本文建立了一个比较完备的材料去除形素体积库，对库中的材料去除形素体积也进行了详细地描述。
EDM in gas can make less electrode wear, but its high short circuit ratio will lead to unstable process and thus low material removal rate.
气中电火花加工时电极相对损耗很小，但由于短路率过高导致加工不稳定、材料去除率不高，还会产生烧焦气味。
The existence of the soft layer could increase the material volume removed by one particle and increase the material removal rate during CMP.
软质层的存在一方面增大单个磨料所去除材料的体积，增加材料去除速率；
Residual stress redistribution of blank due to part material removal is an important factor that results in the deformation of monolithic part.
材料去除导致毛坯中的残余应力重新分布是引起加工变形的重要因素。
Successful design of tools for the material removal processes requires, above all, a complete understanding of cutting tool function and geometry.
为材料的去除工艺而成功设计的刀具，首先需求的是对工具功能和形状的彻底了解。
In this paper the development of the investigations of material removal mechanisms in ceramic grinding is described, and some discussions and conclusions are given.
介绍了陶瓷磨削的材料去除机理方面的研究进展，就其进行了一定的讨论，并得出相关的结论。
The experiment illustrated that the small value of glass breakage diameter and high material removal rates could be obtained by using diamond tool with small slots.
试验结果表明，在电镀金刚石工具端部开槽，可获得小的玻璃爆边直径和高的材料去除率。
Honing experiments are executed and the relationships between reticulate cross-angle, honing pressure, honing rates and material removal rate are analyzed in rough honing.
对珩磨精密加工工艺进行了实验研究，分析了粗珩加工中网纹角、工作压力、珩磨速度与材料去除率的关系。
The dissertation also constructs the inference and evaluation system of the model of material removal volumes. The recognition algorithm of material removal volumes is advanced.
本文同时建立了材料去除形素体积模型的推理和评价系统并提出了从模型中识别材料去除形素体积的算法。
The tool, part geometry, machining conditions, tool-path and the material removal process are simulated by computer simulating technology to gain a rational optimized milling plan finally.
通过计算机仿真技术，模拟刀具、工件几何体、加工环境及刀具路径和材料去除的过程，最终在加工之前得到了合理、优化的加工方案。
The paper introduces the structure of JW MPS and main algorithms, including model construction of machining center, collision and interfere check, NC code translation, material removal etc.
本文介绍了JW-MPS的结构和主要算法，主要包括加工中心建模、碰撞和干涉检验、数控代码翻译和材料切除等。
The Influence of three grinding fluids on grinding force, metal material removal rate, surface roughness of ground workpiece, and the extent of grinding bum were investigated in this paper.
本文研究了三种磨削液对磨削力、金属磨除率、表面粗糙度和烧伤程度的影响。
Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
基于这种机理，应用微观接触力学和磨粒粒度分布理论建立了一种新的表征CMP过程材料去除速率的数学模型。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
Metal manufacturing technology is a process contains multiscale coupling phenomenon where fracture of atomic bond in the microscopic area will lead to the material removal in the macroscopic area.
金属切削工艺是一种隐含着微观和宏观之间耦合作用的过程，微观局部原子间化学键的断裂将会最终导致材料的宏观去除。
On the basis of analyzing the semiconducting material removal rate of EDM and making semiconductive modification for CVD diamond thick film by boron-doping, EDM of the thick diamond film was realized.
本文在分析了电火花加工半导体材料去除速率的基础上，通过掺硼对CVD金刚石厚膜进行半导体改性，继而实现了其电火花加工。
Material removal by machining involves interaction of five elements: the cutting tool, the toolholding and guiding device, the workholder, the workpiece, and the machine.
材料的切削与5个因素有关：刀具，刀具的夹具和导向装置，工件的夹具，工件和加工机器。
Material removal by machining involves interaction of five elements: the cutting tool, the toolholding and guiding device, the workholder, the workpiece, and the machine.
材料的切削与5个因素有关：刀具，刀具的夹具和导向装置，工件的夹具，工件和加工机器。
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