It has certain guiding significance for the LED packaging manufacturing process.
得到的结果对LED封装制造过程有指导意义。
The influences of white light LED packaging process on its performance are discussed in this paper.
研究了在蓝光芯片加黄色荧光粉制备白光LED方法中，色坐标位置对光通量的影响。
Adhere to the high quality product line, professional production of high-grade LED packaging products and LED lighting products.
坚持走高品质产品路线，专业生产中高档LED封装产品与LED照明产品。
The research is important for improving the reliability of LED packaging and proposing the method of detecting welding faults during LED packaging.
该研究对提高LED封装的可靠性和提出检测LED焊接缺陷的方法具有重要意义。
The invention discloses a method for preparing an organic substance, in particular to a method for preparing methyl phenyl cyclosiloxane for LED packaging.
本发明公开了一种有机物的制备方法，具体是指一种LED封装用甲基苯基含氢硅油的制备方法。
It is discusses the effect way to improve high power LED packaging technology, from dice selection, improve thermal management and how to select silicon Gel.
从芯片选择、改善热处理工艺以及如何选择硅胶等几个方面入手，本文讨论了如何有效地提高功率型LED封装工艺。
This product USES 12 white LED, no color, lamp can be rotated up and down, using 3 5 batteries. Color box packaging.
本产品使用12个白光led，无色差，灯头可上下旋转，使用三节5号电池，。彩盒包装。
High power LED Lamp is characterized by small volume, light weight, epoxy resin packaging, good impact resistance and unbreakable property.
大功率LED灯体积小、重量轻，环氧树脂封装，可承受高强度机械冲击和震动，不易破碎。
Chinese specialist laboratory says it has finished the test of the metal packaging of a canned Sprite soft drink which is alleged to have led to the mercury poisoning to a man in Beijing.
中国一家专业实验室称已完成了对罐装雪碧金属包装材料的检测，这种饮料被指控导致北京一名男子发生汞中毒。
A packaging structure of high-power LED was presented, microlens array was employed in the secondary optical design, optical properties of the package was studied using Trace pro.
建立了一种大功率LED的封装结构，二次光学设计采用了微透镜阵列技术，运用光线追踪法研究了这种封装结构的光学性能。
This combination of properties has led to its use for specialized packaging in the industrial and military fields, including the short-term storage of potable water.
这些组合性能导致TPU薄膜主要应用于工业和军事领域的特殊包装上，包括饮用水的短期贮存。
As compared with traditional packaging method, the coating method with phosphors away from the LED chip can improve the luminous efficiency by more than 5%.
与传统封装方法相比，采用荧光粉远离芯片的封装方法可使发光效率提高5%左右。
Series E14 incorporates the latest in microelectronic packaging, LED light sources, and matched sensors.
系列E14采用了最新的微电子封装，LED光源，及配套传感器。
The invention provides the LED devices adopting the packaging method.
本发明并提供采用上述封装方法的LED器件。
Two kinds of 1 W white high power light emitting diode (LED) were made by packaging blue chips from Taiwan and US. The chips were coated by the same phosphor and transparent silica gel.
制备了两种1W白光功率发光二极管（LED），这两种样品分别是对台湾和美国两家公司生产的蓝光芯片，涂敷相同荧光粉和透明硅胶封装而成。
The invention relates to a packaging method for flip LED chips, which belongs to the field of LED fabrication.
本发明涉及一种倒装led芯片的封装方法，属于LED制造领域。
Products include metal packaging shell, seal connectors, lithium battery cover group, sensor, a high power LED lamp sintering stent 5 old series such as several varieties.
产品包括金属封装外壳、密封连接器、锂电池盖组、传感器烧结座、大功率LED灯支架等五大系列十几个品种。
Capacitor, transistor, the transistor, LED lights, key switch, resistor, connectors, wire, potentiometers, fuse blocks, fuse, and other vertical Tape packaging materials.
元件种类components Kind电容器、晶体管、三极管、LED灯、按键开关、电阻、连接器、线圈、电位器、保险丝座、熔断丝等立式编带封装料。
Capacitor, transistor, the transistor, LED lights, key switch, resistor, connectors, wire, potentiometers, fuse blocks, fuse, and other vertical Tape packaging materials.
元件种类components Kind电容器、晶体管、三极管、LED灯、按键开关、电阻、连接器、线圈、电位器、保险丝座、熔断丝等立式编带封装料。
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