Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。
The sequential thermal cycling (TC) and drop impact test is more reasonable to evaluate the reliability of lead-free solder interconnections compared with single TC test or drop impact test.
焊料微互连在热周期和跌落冲击顺序载荷下的可靠性研究更具有实际意义。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
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