The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。

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The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。

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