Some polyurethane resin coating contains more free TDI, brushed in besmear in the process of volatile, will lead to latex paint of yellow.
有的聚氨酯树脂涂料中含较多的游离tdi，在涂刷挥发过程中，将会导致乳胶涂料泛黄。
However, many problems such as materials selection, soldering process and device, system compatibility are still obsessing the development and application of lead-free solders.
然而无铅化仍然存在材料、工艺、设备、系统兼容等问题。
In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
This article describes the base material, surface finish, and process changes to be considered when moving to a lead free product that will require UL Certification.
本文描述了无铅产品在获得UL认证时，所需要考虑的基料、表面处理和工艺方面的变化。
This article describes the base material, surface finish, and process changes to consider when moving to a lead free product that will require UL Certification.
本文描述在实现需要UL认证的无铅产品时必须考虑的基料、表面处理和工艺变革。
In the transition to lead-free from lead, there is expected to be a period when lead and lead-free materials will be used within the same mounting process for the manufacturers of electronic products.
在从有铅向无铅转换过程中，电子产品制造商不可避免会碰到同一组装过程中有铅和无铅的混合情况。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
It is shown that conventional emulsion polymerization process leads to high gloss film and soap-free or micro-soap processes will lead to good water resistance and lower foaming.
研究表明采用常规乳液聚合涂膜的光泽较高，而采用无皂和微皂乳液聚合涂膜的耐水性较好，涂料的起泡性较低。
This article describes the base material, surface finish, and process changes to consider when moving to a lead free product that will require UL Certification.
本文描述了无铅产品在获得UL认证时，所需要考虑的基料、表面处理和工艺方面的变化。
This article describes the base material, surface finish, and process changes to be considered when moving to a lead free product that will require UL Certification.
本文描述在实现需要UL认证的无铅产品时必须考虑的基料、表面处理和工艺变革。
This paper discussed concept, challenges and current problems of final surface finishing process for PCB. Trend of being lead-free for electronic products was proposed.
对印制板表面终饰工艺的概念、面临的挑战及现存的问题进行了阐述，并提出了电子产品的无铅化趋势。
Will lead free components require any new process equipment or equipment replacement ? if so , please list.
无铅化的产品需要一些新的机台设备或会有一些现用机台被替换吗?如有。请列出。
Through appearance testing, X-Ray testing and temperature cycling testing, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
Through appearance testing, X-Ray testing and temperature cycling testing, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
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