The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
The reasons of plating layer blister on multilayer ceramic package are analyzed. On the base of practice the resolve methods are indicated.
本文对多层陶瓷外壳电镀层起泡的成因进行了探讨和分析。在实际工作的基础上，提出了解决起泡应采取的措施。
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