A carrier substrate is thereafter attached to the laser-ablative adhesive layer.
载体衬底随后连附到激光烧蚀粘合层。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate.
在半导体衬底的正面形成C4研磨带和激光烧蚀粘合层。
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