Range of kerf width and exposure may be changed for optimized performance.
一系列的切缝宽度和曝光可能会改为优化的表现。
The effects of laser process parameters on kerf width and quality were studied.
系统研究了工艺参数对切缝宽度和切缝质量的影响规律。
The results show that kerf width decreases with pulse frequency increases under the same average power and pulse width.
结果表明，当平均功率和脉冲宽度相同时，切缝宽度随着脉冲频率的增大而减小；
The results showed that the kerf width increases with the increase of the power density, pulse frequency and pulse width;
结果表明，缝宽随激光功率密度、频率以及脉宽的增加而加大；
In the same of average power, peak power and duty cycle constant, pulse width is the primary parameter which affects the kerf width.
在相同的平均功率、峰值功率和脉宽比下，脉冲宽度是影响切缝宽度主要参数。
At last, the authors give a compensation principle for dimensional accuracy control of grooving kerf width with laser beam for seamless pipe.
最后提出了管材激光割缝时槽宽尺寸精度控制的补偿原则。
To reduce the kerf width and to improve the kerf quality, the experiments of ceramic cutting with water constricted plasma arc are carried out.
为减小切口宽度，提高切口质量，进行了水再压缩等离子弧切割陶瓷实验研究。
In order to reduce the kerf width and improve the kerf quality, the hydromagnetically confined plasma arc was used to cut engineering ceramic plates.
为减小陶瓷板件切口宽度，提高切口质量，采用水箍和磁场对附加阳极等离子弧进行综合二次约束。
The effects on kerf width and quality made by laser facula diameter, focal point position, cutting speed, laser power and other technological parameters were studied.
研究了激光光斑直径及离焦量、切割速度、激光功率等工艺参数对齿轮切缝宽度及加工质量的影响。
At last, the authors regard that variable parameters are necessary for people to adopt in order to obtain a uniform kerf width for thin seamless steel pipe with a small diameter.
最后提出，为了获得均匀宽度的圆周切缝，对于薄壁小管径无缝钢管激光切缝，应采取变工艺参数的措施。
The basic principle, test device, and the regularity of cutting parameters affecting to the arc characteristics, kerf width, kerf Angle, and dross free cutting speeds are dealt with.
内容涉及基本原理、实验装置及加工参数对弧柱特性、切口宽度、切口角、无渣切速的影响规律。
The results show that the kerf width increases with the increase of laser power, pulse frequency, pulse width and assist gas pressure, but decreases with the increase of cutting speed.
结果表明：缝宽随输出功率、频率、脉宽及辅助氧压的增大而增加，随着切割速度的增加而减小。
This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.
这是采用独特的多光束技术实现的，图2显示了其工作原理，降低了功率密度，减小了热负载，缩小了刻线宽度。
This is achieved by using a unique multi beam technology, demonstrated in figure 2, which reduces the power density, minimizes the thermal load, and reduces the kerf width in the wafer.
这是采用独特的多光束技术实现的，图2显示了其工作原理，降低了功率密度，减小了热负载，缩小了刻线宽度。
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