However, the predominant process of secondary ion sputtering is kinetic sputtering, which closely related to the momentum deposition on the target surface (nuclear stopping power).
而主导二次离子溅射的过程是动能溅射，它与靶表面的动量沉积(核能损)过程密切相关。
Ion sputtering yields on t? Ti target are numerically calculated with TRIM program.
应用TRIM程序模拟了离子在氚钛靶上的溅射产额。
Ion sputtering yields on t? Ti target are numerically calculated with TRIM program.
应用TRIM程序模拟了离子在氚钛靶上的溅射产额。
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