The options provide cost-effective, scalable solutions for complex PCB and IC packaging designs.
该选件为复杂的PCB与IC封装设计提供了可节约成本和可升级的解决方案。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
Based on the ac permanent magnetic synchronous linear motor in IC packaging devices, the fundamental principle of linear motor is introduced and a simple but effective model is established.
针对高速高精芯片封装平台的交流永磁直线同步电机驱动系统，阐述直线电机运行的基本机理，并建立简洁实用的数学驱动模型。
Based on the ac permanent magnetic synchronous linear motor in IC packaging devices, the fundamental principle of linear motor is introduced and a simple but effective model is established.
针对高速高精芯片封装平台的交流永磁直线同步电机驱动系统，阐述直线电机运行的基本机理，并建立简洁实用的数学驱动模型。
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