Feb import dual-use monitoring system is linear and IC packaging.
测系统选用进口双列封装的线性和集成电路。
TDA1170N is a single chip vertical scanning IC with 12 pins and square shaped plastic packaging.
TDA1170N是一种单片式电视场偏转集成电路，有12个引脚，呈方形直插塑封。
The options provide cost-effective, scalable solutions for complex PCB and IC packaging designs.
该选件为复杂的PCB与IC封装设计提供了可节约成本和可升级的解决方案。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.
传统的前向拱丝越来越难以满足目前封装的高密度要求，反向拱丝能满足非常低的弧高的要求。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
Based on the ac permanent magnetic synchronous linear motor in IC packaging devices, the fundamental principle of linear motor is introduced and a simple but effective model is established.
针对高速高精芯片封装平台的交流永磁直线同步电机驱动系统，阐述直线电机运行的基本机理，并建立简洁实用的数学驱动模型。
Mobile power sets of materials, batteries, programs, wire, packaging, PCBA, lithium battery management IC;
移动电源套料，电芯，方案，线材，包装，PCBA、锂电池管理IC；
Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and laser micro welding applied in the IC fabrication and packaging are given.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
IC manufacturing faced the challenges of physical limits, 3d packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3d封装技术越来越成为了微电子行业关注的热点。
PS\PC narrow band is a kind of packaging products, mainly for the IC, resistance, inductance, capacitance, connectors, fuses, switches and other electronic components of the packaging.
PC 电子载带属于包装类产品，主要用于IC、电阻、电感、电容、连接器、保险丝、开关等电子元器件的包装。
The company ' s primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
The company ' s primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
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