Three key technologies, CPK, SPC and PPM, for evaluating quality and reliability of IC chips were studied.
对CPK、SPC和PPM三项评价IC芯片质量和可靠性的关键技术进行了研究。
Methods IC chips powder samples were prepared, and the OSL curves and their dose response and stability were measured.
方法取常用的塑封集成电路芯片制成粉末样品，测量其光激发光信号对辐射剂量的响应。
This paper is intended to improve the regular structure of driving circuits by an analysis of factors that cause instant power drop of voltage in the multiple output of digital IC chips.
通过分析数字集成芯片多输出中电源电压瞬间下降的原因，对常规驱动电路结构进行改进。
In integrated circuit (IC) chips design, the verification is one of the most complex and time-consuming step in the chips design flow.
在集成电路(IC)芯片设计中，验证是芯片设计流程中最复杂、最耗时的环节之一。
In integrated circuit (IC) chips design, the verification is one of the most complex and time-consuming step in the chips design flow.
在集成电路(IC)芯片设计中，验证是芯片设计流程中最复杂、最耗时的环节之一。
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