Phase-locking loop circuit, phase shifting method, and IC chip.
锁相环电路，相移方法，及集成电路芯片。
With the advent of the era of deep sub-micron IC, the feature size on the IC chip is shrunk to nanometers.
伴随着深亚微米集成电路时代的来临，芯片的特征尺寸已经缩小到纳米尺度。
The present invention may improve quality factor of the spiral inductor structure and integrate the same onto the IC chip.
本发明能够提高螺旋电感结构的品质因数，并可将其整合于IC芯片上。
It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
A video character superimposition system is designed based on the IC chip MB90092, and the design of the software for MB90092 is discussed.
基于MB90092芯片设计了视频字符叠加系统，以此为基础论述了MB90092的软件设计方法。
The test circuit receives the second clock signal and the first clock signal outputted by the first IC chip to generate a comparable signal.
检测电路接收第二时钟讯号和第一集成电路芯片所输出的第一时钟讯号，以产生一比较讯号。
AD73360 is a programmable three-phase electrical parameter measurement IC chip. It is mainly used in industry ammeter and multi-input systems.
AD 73360是一主要适用于工业电表和多路输入系统的可编程三相电量测量ic器件。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
The integral period sampling, which is realized by realtime frequency calculation and voltage capture function of IC chip, is necessary for precise digital signal processing.
借助芯片的捕获功能，计算信号的实时频率，实现了整周期采样，保证了数字信号处理的精度。
TI's TMS320VC5402 DSP IC chip is used as the central processor of the system so that the video acquisition, video image extract and data analysis can be integrated into one system.
该系统采用TI公司TMS320VC5402DSP芯片作为核心处理器，可以对来自于摄像头的模拟视频信号中的图像进行采集、提取、分析一体化处理。
Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance.
因为在印刷布线板10内设置了片状电容器20，所以能够缩短IC芯片90与片状电容器20的距离，降低环线电感。
Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance.
因为在印刷布线板10内设置了片状电容器20，所以能够缩短IC芯片90与片状电容器20的距离，降低环线电感。
应用推荐