With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
The present invention provides a method of thermal sink for flip of preparing nitride-based laser, characterized in that the method includes following steps: step 1, catching a substrate;
一种制做氮化镓基激光器倒装用热沉的方法，其特征在于，该方法包括如下步骤：步骤1：取一衬底；
The present invention provides a method of thermal sink for flip of preparing nitride-based laser, characterized in that the method includes following steps: step 1, catching a substrate;
一种制做氮化镓基激光器倒装用热沉的方法，其特征在于，该方法包括如下步骤：步骤1：取一衬底；
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