Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。

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Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。

youdao