The MEMS skin composed of a flexible substrate layer, a metal electrode layer and a micro-well-array layer was designed, and two process routes based on MEMS were developed for the skin fabrication.
设计了一种包含柔性基底层、金属电极图案层和微凹坑阵列层的三层式蒙皮结构，提出了两种基于MEMS工艺的制作方法。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
应用推荐