A conductive covering part is attached to the main frame on an external end of an exposed external wall, thus finishing the production of the semiconductor packaged to the packaging.
具有导电性的覆盖件被附着到暴露的外围壁的上端上的主框上，从而完成被封装到封装中的半导体的生产。
A conductive covering part is attached to the main frame on an external end of an exposed external wall, thus finishing the production of the semiconductor packaged to the packaging.
具有导电性的覆盖件被附着到暴露的外围壁的上端上的主框上，从而完成被封装到封装中的半导体的生产。
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