Using IC-compatible silicon as substrate and MEMS processing technology, it is fabricated with silicon wet etching and SU8 micro reaction pool.
以与IC兼容的硅作为基底材料，利用MEMS加工工艺，采用硅腐蚀及SU8微反应池方法制成了新型微电极传感器。
The etching effect factors such as solution concentration, temperature, reaction time and ultrasonic stirring etc were also investigated.
分析了酸性溶液中酸浓度、溶解温度、溶解时间和超声波作用对多组分磷酸盐玻璃化学浸蚀的影响。
The etching effect factors such as solution concentration, temperature, reaction time and ultrasonic stirring etc were also investigated.
分析了酸性溶液中酸浓度、溶解温度、溶解时间和超声波作用对多组分磷酸盐玻璃化学浸蚀的影响。
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