Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high.

因此，基板上存在的铜部分和通过电镀形成的铜沉积物之间的连接的可靠性是显著的。

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Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high.

因此，基板上存在的铜部分和通过电镀形成的铜沉积物之间的连接的可靠性是显著的。

youdao