Their working model is a shoebox-sized package of electronics and liquid-filled tubes, with a silicon chip at its core.
他们的工作模型是一个鞋盒大小的电子盒和一个填满液体的管道，这个模型的核心是一块硅片。
Samsung Electronics announced that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.
三星电子最近宣布，他们发明出了工业界第一个TECOF装置，这能用于大屏幕、高分辨率的LCD电视中的显示器驱动器集成电路（DDI）。
More often, the micromachined part and electronics are fabricated separately and then wire bonded together in a single package.
通常，显微机械加工的部件和电子电路是分开制造的，然后在同一封装块内用线将它们连在一起。
The production situation and the application of synthetic resin in agriculture, construction, automobile, electronics and package in China were introduced, and its development trend was predicted.
介绍了国内合成树脂的生产现状及其在农业、建筑、汽车、电子工业、包装业等领域的应用情况，并对其发展趋势进行了预测。
With 3d printing you could make the decorative shape and the encapsulated electronics all parts of one package that was both decorative and lensing.
随着3d打印，你可以做装饰造型和电子封装一个软件包的所有部分，这是装饰性和透镜。
Widely used in bamboo and wood articles, garment industry, food, beverage, package, handicraft industry, PCB, telecom apparatus, electronics, machinery manufacturing industries.
广泛应用于竹木器，服饰，食品，饮料，包装，工艺品，PCB，通讯器材，电子，仪表仪器，电子等行业。
The invention is related to an electrical time and humidity or moisture sensor incorporated in a package or packaging material of goods, particularly electronics, foodstuffs and degradable products.
本发明涉及一种结合在商品、特别是电子产品、食品和可降解产品的包装或包装材料中的时间和湿度或湿气的电传感器。
The paper briefly introducedd the work principle and performace parameter of automatic distributor for filling package and introduced mainly the technology and feature of the electronics control.
本文扼要介绍了自动投料机的工作原理、性能参数，重点介绍了电器控制技术和特点。
Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4gb multi-chip package (MCP) targeted at 3g mobile phones market.
三星电子公司，是全球领先的半导体和电信制定了一个4gb的多芯片封装(MCP)针对3g手机市场。
Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4gb multi-chip package (MCP) targeted at 3g mobile phones market.
三星电子公司，是全球领先的半导体和电信制定了一个4gb的多芯片封装(MCP)针对3g手机市场。
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