We are the inventor of the world's first electronic thermal transfer barcode printer.
我们发明了世界上第一台热转印条码打印机。
The results showed that electronic thermal conductivity had different effects on electronic maximum temperature, electron-phonon coupling time and electron-phonon coupling temperature.
结果表明：电子热导率对金靶材表面电子最高温度，电声耦合时间及电声耦合温度都有不同程度影响。
Width to create a single molecule without thermal damage of the conductive metal lines means that a new electronic components can simultaneously solve two problems.
创造出单分子宽度无热损的导电金属线意味着一种新型的电子元件可同时解决两个难题。
The thermal design of on-orbit electronic product under space environment is the key of the product design.
空间环境下直接面向运行轨道电子产品的热设计是产品设计的关键。
We should synthetically consider the effect of the chopper's parameters when designing the whole thermal imaging system and electronic processing system.
在热成像系统总体设计以及电子处理系统设计时，必须综合考虑斩波器各参数的影响。
From the features of thermal relay and electronic motor protector, the advantages of electronic motor protector were emphasized.
从热继电器和电子式电动机保护器的特点出发，强调了电子式电动机保护的优点。
The thermal-detector is an electronic device which can measure the thermal conductance ability of gem, using to distinguish the jewelry.
热导仪是一种通过测定宝石热传导能力来鉴别钻石真伪的电子仪器。
Obtaining the characteristic device curve of the equipment is important in the thermal design of electronic equipment.
确定电子设备的风道特性是电子设备热设计的一个重要内容。
Simulation of thermal deformation is significant to enhance thermal reliability of electronic devices.
电子器件热变形的模拟对于提高器件的热可靠性有着重要意义。
To meet the needs of the electronic package materials, the thermal properties of the composites were analyzed.
适应电子封装选材的应用背景，对复合材料进行了热学性能分析。
This paper introduces the application of CAD technology to thermal analysis of electronic equipment on satellite and the characteristics of thermal analysis system.
介绍了CAD技术在星载电子设备热分析中的应用和相关热分析系统的特点。
In this paper, the thermal design program for color TV set housing is programed according to the basic principles and formulas of the thermal design for electronic devices.
本文根据电子设备热设计的基本原理和公式，编制了彩色电视机机壳热设计程序。
Electronic chip's thermal analysis and design study is to the key to improve the reliability of chip.
对电子芯片进行热分析和设计研究，是提高芯片可靠性的关键。
The analyses for lifetime spectra show that a large number of thermal vacancies are recovered and the bulk electronic density increases during the peak ageing process.
分析表明：峰值时效使热空位大量回复并使基体电子密度提高。
Nowadays the thermal losses of power electronic devices like CPU are increasing. At the same time, their sizes are decreasing. Consequently heat sinks have to dissipate very large heat flux.
如今CPU等电子设备散发的热量越来越多，而尺寸却越来越小，结果是散热器必须处理的热流密度越来越大。
We can conclude from experiments and numerical comparisons that this software package can provide timesaving and accurate thermal analysis for electronic equipment.
经过实验研究及数值分析对比可知：该软件可以对计算机机箱类的电子设备进行相对精确同时又比较省时的热特性分析。
The module design method, thermal resistance model method, thermal emulation analysis method and thermal test method can be used for thermal design of military and civilian electronic equipment.
本文的模块设计方法、热阻模型分析方法、热仿真分析方法、热测试方法可用于对军民用电子设备的热设计。
Mathematical simulation has been performed by means of electronic computor for two types of ideal flow reactor systems used for the thermal bulk polymerization of styrene.
应用电子计算机对两种理想流动模型的苯乙烯本体热聚合反应器进行了初步数学模拟试验。
Concurrent engineering will be essential to integrate the electronic, structure and thermal design.
协作工程学对于把电子、结构和热设计集成看成是最重要的。
Thermal design is very important for reliability of electronic equipments. Due to miniaturization of electronic equipment, the higher request is put forward to the thermal design.
热设计是影响电子设备可靠性的一个重要因素，电子设备的小型化对热设计提出了更高的要求。
Thus how to get a scientific and rational design of electronic equipment to meet the requirements of thermal performance is of great concern to engineers.
如何科学合理地设计电子设备以满足其热性能的要求，是一个工程界十分关心的问题。
Aiming at the thermal design problem of high-power components in electronic equipments, this paper introduces one practical thermal design method of forced air cooling of electronic equipment.
针对电子设备中高功率器件的热设计问题，介绍了一种实用的强迫风冷散热设计方法。
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
Analysis and design of electronic cabinets, usually involving structural design, thermal design and EMC design of the interaction of the three disciplines.
电子机柜的分析和设计，通常涉及结构设计、热设计以及电磁兼容设计等三个学科的相互作用。
Phase change thermal control has been widely used in thermal control of electronic devices recently because it has compact structure, reliable performance and energy-saving property.
相变温控因其装置结构紧凑、性能可靠、经济节能等优点近年来被广泛地应用在各类电子设备的温控上。
According to flight feature and transitional thermal load value, scheme of temperature adjusting system of electronic equipment cabin was presented.
根据高空高速飞行特点及瞬态热载荷值，确定仪器设备舱调温系统方案。
The experimental result shows that using electronic expansion valve instead of thermal expansion valve, the cooling capacity increases by 11.4%, COP increases 9.6%.
试验表明：使用电子膨胀阀对比使用热力膨胀阀，机组的制冷量提高11.4%以上、COP提高9.6%以上。
The experimental result shows that using electronic expansion valve instead of thermal expansion valve, the cooling capacity increases by 11.4%, COP increases 9.6%.
试验表明：使用电子膨胀阀对比使用热力膨胀阀，机组的制冷量提高11.4%以上、COP提高9.6%以上。
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