Some aspects that need to be deeply studied on electroless gold plating for engineering plastics were put forward.
提出了对塑料表面镀金工艺还需深入研究的几个方面。
Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.
利用化学镀镍作阻挡层，化学镀金作可焊层，可得到良好的焊接效果。
Post-CMOS processes including electroless gold plating and special package technique are implemented to enhance the biocompatibility and stability of the biosensor.
在标准CMOS工艺基础上，应用无电浸镀金改进传感电极的生物兼容性，并采用特殊封装技术提高芯片在溶液环境中的稳定性。
This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder.
本文总结了影响化学镀镍金可焊性的复杂因素如：前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
The sequence of NIRUNA ENIG corresponds with common processes and can be adapted to electroless Nickel Gold plants after adjustment.
niruna沉镍金流程程序相应于一般沉镍金流程，经调整后可被改用于此流程。
The sequence of NIRUNA ENIG corresponds with common processes and can be adapted to electroless Nickel Gold plants after adjustment.
niruna沉镍金流程程序相应于一般沉镍金流程，经调整后可被改用于此流程。
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