Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
无背板生长法是利用SU - 8光刻胶，通过低成本的UV -LIGA技术，直接在金属基板上电铸镍图形来实现的。
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
无背板生长法是利用SU - 8光刻胶，通过低成本的UV -LIGA技术，直接在金属基板上电铸镍图形来实现的。
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