The equipment mostly check up background currents, leakage-current, dynamic impedance and C-V characteristic etc.
该设备主要检测晶片、芯片的背景电流、漏电流、动态阻抗和C-V特性等参数，使之满足探测器要求。
The equipment mostly check up background currents, leakage-current, dynamic impedance and C-V characteristic etc.
该设备主要检测晶片、芯片的背景电流、漏电流、动态阻抗和C-V特性等参数，使之满足探测器要求。
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