I suspect there is a deviation in the draw nozzle chip time, and then when welding vacuum leak, resulting in a tin material is attracted...

怀疑吸嘴在吸取芯片的时候存在偏差，然后在焊接的时候真空漏气，最终导致了锡料被吸到芯片表面。

youdao

I suspect there is a deviation in the draw nozzle chip time, and then when welding vacuum leak, resulting in a tin material is attracted...

怀疑吸嘴在吸取芯片的时候存在偏差，然后在焊接的时候真空漏气，最终导致了锡料被吸到芯片表面。

youdao