Diffusion of oxygen in the bonding coating and substrate is mainly grain-boundary diffusion. Grain-boundary diffusion coefficient is far greater than intragrain diffusion.
氧在粘结底层和基体中的扩散是以晶界扩散为主，晶界扩散系数远远大于晶内的扩散系数。
Diffusion of oxygen in the bonding coating and substrate is mainly grain-boundary diffusion. Grain-boundary diffusion coefficient is far greater than intragrain diffusion.
氧在粘结底层和基体中的扩散是以晶界扩散为主，晶界扩散系数远远大于晶内的扩散系数。
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