The router creates jogs to compensate for pins that are not aligned. This forces the channels to expand vertically and increases the die size.
布线器为没有对齐的引脚创建直角走线来弥补，直角走线强迫了通道在垂直方向上扩大并且增大芯片尺寸。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
应用推荐