The protection plate (10) is formed within the first dielectric layer (14) using a damascene process.

保护板(10)利用镶嵌工艺在第一介质层(14)中形成。

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The protection plate (10) is formed within the first dielectric layer (14) using a damascene process.

保护板(10)利用镶嵌工艺在第一介质层(14)中形成。

youdao