The hardware design of the module mainly presents analogue channel circuit design, A/D acquisition circuit design, digital control circuit design, power and CPCI interface design.
主要介绍CPCI数字存储示波器模块的模拟通道设计、A/D采样设计、数字控制电路设计、电源设计以及CPCI接口设计。
The design of hardware module includes A/D converter, DDC (Digital Down Converter) and DSP. The design and application of AD6640 and AD6624 are fully discussed in this part.
模块的硬件设计主要包括：A／D转换器、数字下变频器（DDC）以及DSP，详尽讨论了A／D 器件AD6640和DDC 器件AD6624的设计和应用；
The text describes the R&D process for 2CZ234 high current, small package rectifier module.
阐述了2CZ234型大电流小封装整流组件的研制过程。
Sample the negative voltage on the diode series with IGBT by Peak hold switch circuit, and cut-in A/D module in the DSP, compared with setting value.
通过电压峰值采样保持电路对IGBT串联二极管反压值进行采样，后经DSP A/D转换模块与反压设定值进行比较。
The 32 channel isolated scan A/D module is also discussed in the thesis, including trigger module and time se.
介绍了32路扫描A/D模块设计及触发模块设计和扫描时序发生器设计。
There were analog multiplexers, A/D conversion(analog digital conversion), FIFO module, CPLD module in the hardware design and CPLD program, USB firmware, USB driver in the software design.
在硬件上包含多路开关、模数转换、FIFO模块、CPLD模块、USB模块； 在软件上包含CPLD编程、USB固件、USB驱动以及应用程序。
In the design of hardware, the paper details in introducing the reader circuit and function module, especially the theory and method of design in D-type power amplifier, Manchester code and coil.
在硬件设计方面，完成了阅读器主电路及功能模块的设计，特别是对D类功率放大器、编码器和电感线圈的设计理论和方法作了详细介绍。
The machine can turn about 200 kinds of the metric, imperial, module and D. P. thread with knob, no need to change gears.
本机可以把约200种的公制，英制，模块和DP螺纹旋钮，没有必要改变齿轮。
The system is comprised of sensors, silicon controlled module, single-chip microcomputer system, A/D and D/A converters.
该系统由电量传感器、可控硅模块、单片机系统、A/D和D/A转换器等组成。
The research on the module of preamplifier, A/D voice input, D/A voice output, and controlling of the system is laid stress on.
重点研究了系统的前置放大模块、A／D音频输入与D／A音频输出模块，以及系统控制模块。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Secondly, we designed the module in detail around TMS320C32, the core of control system, such as external storage module, PC-DSP data switch module, D/A output module.
其次，围绕着TMS320C32核心处理单元设计了运动控制系统的存储模块，PC-DSP数据交换模块，D/A输出模块等各部分的电路组成。
The decision fusion level module USES D-S evidence theory to fuse the local diagnostic results of feature fusion level, then get the final diagnostic results.
决策级采用D - S证据理论的方法对特征级局部诊断的结果加以融合，得到最终的诊断结果。
System design mainly includes the addition circuit, A/D analog-to-digital conversion module, serial communication module, PC display module, etc.
系统设计主要包括加法电路，A/D模数转换模块，串口通信模块，上位机显示模块等部分。
Main functions and characteristics of the 2-d information inquiry module of the Yangtze River Channel information Service System are presented in this paper.
介绍了长江河道信息服务系统二维信息查询模块的主要功能与特点。
A 3-d memory module (3d-mm) is disclosed, whose storage capacity and external size are better than that of same-period micro-hard-disk (CMD).
本发明提供了一种三维存储模块(3d - MM)，它在存储容量和外部尺寸方面优于同期微硬盘(CMD)。
The web browse of 3-d solid model is realized in the product structure management module.
在产品结构管理中实现了三维模型图的网络浏览。
The design progress and R&D plans of Chinese ITER test blanket module design based on the solid breeder concept are also presented.
最后，介绍了国内开展的基于固体增殖剂概念的ITER实验包层的初步设计概况，对TBM的研发计划提出了建议。
The design progress and R&D plans of Chinese ITER test blanket module design based on the solid breeder concept are also presented.
最后，介绍了国内开展的基于固体增殖剂概念的ITER实验包层的初步设计概况，对TBM的研发计划提出了建议。
应用推荐