The crystallographic effects on critical depth, micro cutting forces and surface waviness when machining single crystals are emphatically investigated.
重点研究了加工单晶材料时晶向对临界切深、微切削力和表面粗糙度的影响；
The crystallographic effects on critical depth, micro cutting forces and surface waviness when machining single crystals are emphatically investigated.
重点研究了加工单晶材料时晶向对临界切深、微切削力和表面粗糙度的影响；
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