Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc.
生产上常用的镀铜工艺有氰化镀铜、酸性镀铜、焦磷酸盐镀铜等。
Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.
电镀铜层具有良好的导电、导热、延展性等优点，因此，电镀铜技术被广泛应用于电子材料制造领域。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
The invention relates to a nickel plating technology for aluminum alloy that includes zinc-depositing, copper plating and nickel plating processes.
本发明涉及一种给铝合金材料镀镍的工艺，具体的讲涉及一种给铝合 金灯头、灯座上镀镍的工艺流程。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
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