Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
The electroless copper plating system with sodium hypophosphite as the reducing agent has been received people's attention.
由于金属铜对次磷酸钠的氧化没有催化作用，需要加入镍离子作为催化剂。
The electroless copper plating system with sodium hypophosphite as the reducing agent has been received people's attention.
由于金属铜对次磷酸钠的氧化没有催化作用，需要加入镍离子作为催化剂。
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