A new non-cyanide alkaline copper plating process was introduced.
介绍了一种新的无氰碱铜工艺。
Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
The disadvantages of common electroless copper plating process were pointed out.
指出了普通镀铜工艺的缺点。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
The inner anode and its choice for copper plating on stainless steel was emphatically introduced.
重点对不锈钢镀铜的内阳极及其选择作了介绍。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
A process for continuous copper plating on steel wire at high current densities was described in detail.
介绍了高电流密度连续生产钢芯镀铜线工艺。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on…
本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。
A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.
研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。
Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。
In this paper, the conditions of composite chemical copper plating with two solid particles ZnO and SnO are studied.
研究了氧化锌、氧化亚锡两种固体微粒复合化学镀铜的工艺条件。
"Most" copper "COINS are actually bronze, typically with about 4% tin and 1% zinc, or copper plating over base metal."
很多“铜币”实际上是用青铜铸造的，其典型成分是约4%的锡和1%的锌。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
The paper provides several substrate plating technologies of zinc alloy cast piecework to substitute cyanide copper plating.
本文介绍了几种取代氰化镀铜的锌合金电镀打底工艺。
The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.
硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
The weight of copper plating solution in a unit volume was function of contents of cupric pyrophosphate and potassium pyrophosphate.
镀液单位体积的重量是焦磷酸钾和焦磷酸铜含量的函数。
A method for breaking the complex forming copper precipitation was tested for wastewater treatment of non-cyanide complex copper plating.
同时试验了一种破络沉淀铜的方法处理无氰络合物镀铜废水。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
The processes of application research of rare earth elements as additives on zinc, chromium, nickel, tin, iron, copper plating were described.
简述了稀土添加剂在国内镀锌、铬、镍、锡、铁、铜工艺上的应用研究进展。
The optimal scheme was ascertained as flows: alkaline wash-diluted hydrochloric acid activation-acidic copper plating-replacement silver plating.
确定了最佳方案：碱洗—稀盐酸活化—酸性镀铜—置换法镀银。
The invention relates to a nickel plating technology for aluminum alloy that includes zinc-depositing, copper plating and nickel plating processes.
本发明涉及一种给铝合金材料镀镍的工艺，具体的讲涉及一种给铝合 金灯头、灯座上镀镍的工艺流程。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.
探讨了利用原化学镀铜废液中的甲醛将铜还原，后酸化回收EDTA的新工艺。
The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.
通过实验分别测定了酸性镀铜光亮剂ubac1a和镀液中硫酸铜的吸收曲线。
Rinsing with tap water was popularly adopted between the procedures of strike copper plating and bright sulphate copper plating for copper alloy glasses.
铜合金眼镜架经预镀铜和光亮酸铜工艺处理，工序间普遍采用自来水水洗。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
Results showed that the conductive performance of glass fiber with copper plating increased greatly so that the material could use as electromagnetic shield.
研究表明，玻璃纤维化学镀铜后，可提高导电性能，并用作制备电磁屏蔽材料。
The process formula of acid bright copper plating, acid bright nickel plating, (silver) plating and various colour gold plating on fresh flowers were presented.
并给出了鲜花上酸性光亮镀铜、酸性光亮镀镍、镀银以及镀各种彩色金的工艺配方。
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